Huawei says its next AI chip is ready three quarters early, targeting early 2027
· L2 Silicon · Ascend 960DT moved from Q4 2027 to Q1 2027 (three quarters early); Ascend 960PR moved one quarter early to Q3 2027; Huawei says performance doubles; roadmap continues with Ascend 970 in 2028 · Reported
Huawei's rotating chairman Tao Wang told the company's Huawei Connect conference that its next AI chip, the Ascend 960DT, is ready three quarters ahead of plan and will launch in the first quarter of 2027, with a second chip, the Ascend 960PR, arriving one quarter early. He said performance doubles, but gave no benchmark, no memory figure and no power number to support that, and Huawei's own website did not carry a readable version of the remarks at the time of writing, so this rests on Chinese trade press reporting from the keynote. If accurate, it is a sign China's leading chipmaker is pulling its own AI hardware roadmap forward as it works around restrictions on buying chips from Nvidia and other US companies.